Naslov
Electrodeposition of Gold onto Solicon Monocrystal Wafer in the Fluidized Bed of Inert Particles

Autori
Stanković, Velizar D. ; Gojo, Miroslav

Vrsta, podvrsta i kategorija rada
Sažeci sa skupova, sažetak, znanstveni

Izvornik
50th ISE Meeting : Bicentenary of Alessandro Volta's Invention of the "Electric Pile" : book of Abstracts / Trasatti, Sergio - Pavia : ISE, 1999, 40 4-P

Skup
ISE Meeting (50 ; 1999)

Mjesto i datum
Pavia, Italija, 05.09.1999. - 10.09.1999

Vrsta sudjelovanja
Poster

Vrsta recenzije
Nije recenziran

Ključne riječi
electrochemical deposition of gold; fluidized bed; inert paricles

Sažetak
To intensify the process of silicon monocrystal wafer plating, the fluidized bed of inert turbulence promotors has been used. The other process parameters were the same as wellas in the industrial processof gold plating ; i.e. electrolyte composition, process temperature, silicon wafers pre-treatment etc. Experiments have been caried out in the cell with the fluidized bed of monosized glass beads, using thin wafers of monocrystal silicon (used cathodes production in electronic industry) and plating them by a thin film of gold deposit. Plating was carried out at different current densities and different electrolyte flow-rates. The morphology, along and surface adherence across the wafer, of the obtained gold deposits were investigated. The results were compared with those obtained by conventional plating method. Deposits obtained in fluigized bed were smother ; possessing better adhetence to the substrate and more fine grain size and structure while the depth was more uniform over tthe surface. Besides, process time required to reach demanded gold film tickness was for to five times shoter compared to that need for conventional plating. For exemple, the mass transfer in the fluidized bed withinert particles was faster for same value. Elactrolyte flow-rate had great influence not only on increasing the limiting current density, but also on the deposit quality. It was pointed out that better results were obtained at lower bed expansion. Some side effects indicate that it is more convenient to carry out the plating process at the velocities close to the minimum fluidization velocity. The plating process was aanalysed incourse of energy cosumption as well. In spite of higher cell voltage due to the presence of inert particles in the bed, the total energy ( pumping, and acting in the process) is lower in case of fluidized bed cell for the same operating current density. This effect is less impotant, but not of the minor significance.

Izvorni jezik
Engleski

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