Naslov
Thermal Characterization of Next-Generation Workloads on Heterogeneous MPSoCs

Autori
Iranfar, Arman ; Terraneo, Federico ; Simon, William Andrew ; Dragić, Leon ; Piljić, Igor ; Zapater Sancho, Marina ; Fornaciari, William ; Kovač, Mario ; Atienza Alonso, David

Vrsta, podvrsta i kategorija rada
Sažeci sa skupova, neobjavljeni rad, znanstveni

Skup
The International Conference on Embedded Computer Systems: Architectures, MOdeling, and Simulation (SAMOS)

Mjesto i datum
Samos, Grčka, 17.07.2017. - 20.07.2017

Vrsta sudjelovanja
Predavanje

Vrsta recenzije
Međunarodna recenzija

Ključne riječi
HPC ; Thermal Characterization ; Heterogeneous MPSoCs ; Video Transcoding

Sažetak
Next-generation High-Performance Computing (HPC) applications need to tackle outstanding computational complexity while meeting latency and Quality-of-Service constraints. Heterogeneous Multi-Processor Systems-on-Chip (MPSoCs), equipped with a mix of general- purpose cores and reconfigurable fabric for custom acceleration of computational blocks, are key in providing the flexibility to meet the requirements of next-generation HPC. However, heterogeneity brings new challenges to efficient chip thermal management. In this context, accurate and fast thermal simulators are becoming crucial to understand and exploit the trade-offs brought by heterogeneous MPSoCs. In this paper, we first thermally characterize a next-generation HPC workload, the online video transcoding application, using a highly- accurate Infra-Red (IR) microscope. Second, we extend the 3D-ICE thermal simulation tool with a new generic heat spreader model capable of accurately reproducing package surface temperature, with an average error of 6.8% for the hot spots of the chip. Our model is used to characterize the thermal behaviour of the online transcoding application when running on a heterogeneous MPSoC. Moreover, by using our detailed thermal system characterization we are able to explore different application mappings as well as the thermal limits of such heterogeneous platforms.

Izvorni jezik
Engleski

Znanstvena područja
Računarstvo

POVEZANOST RADA