Pregled bibliografske jedinice broj: 887466
Composite wafers having bulk-quality semiconductor layers and method of manufacturing thereof
Composite wafers having bulk-quality semiconductor layers and method of manufacturing thereof
(2011)
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Naslov
Composite wafers having bulk-quality semiconductor layers and method of manufacturing thereof
Autori
Francis, Daniel ; Ejeckam, Felix ; Wasserbauer, John ; Faili, Firooz ; Babic, Dubravko
Broj patenta
7, 943, 485
Godina
2011
Datum patenta
17.05.2011.
Sažetak
Method for producing composite wafers with thin high-quality semiconductor films atomically attached to synthetic diamond wafers is disclosed. Synthetic diamond substrates are created by depositing synthetic diamond onto a nucleating layer deposited on bulk semiconductor wafer which has been prepared to allow separation of the thin semiconductor film from the remaining bulk semiconductor wafer. The remaining semiconductor wafer is available for reuse. The synthetic diamond substrate serves as heat spreader and a mechanical substrate.
Izvorni jezik
Engleski