Pregled bibliografske jedinice broj: 884924
Cleaved GaN facets by wafer fusion of GaN to InP
Cleaved GaN facets by wafer fusion of GaN to InP // Applied physics letters, 68 (1996), 15; 2147-2149 doi:10.1063/1.115613 (međunarodna recenzija, članak, znanstveni)
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Naslov
Cleaved GaN facets by wafer fusion of GaN to InP
Autori
Sink, R.K. ; Keller, S. ; Keller, B. ; Babić, Dubravko ; Holmes, A.L. ; Kapolnek, D. ; DenBaars, S.P. ; Bowers, J.E. ; Wu, X.H. ; Speck, J.S.
Izvornik
Applied physics letters (0003-6951) 68
(1996), 15;
2147-2149
Vrsta, podvrsta i kategorija rada
Radovi u časopisima, članak, znanstveni
Ključne riječi
epitaxy ; sapphire ; laser fusion ; optical fabrication ; crystal voids
Sažetak
Basal plane sapphire is a common substrate for the heteroepitaxy of GaN. This presents a challenge for fabrication of cleaved‐facet GaN lasers because the natural cleavage planes in (0001) α‐Al2O3 are not perpendicular to the wafer surface. This letter describes a method for achieving perpendicular cleaved facets through wafer fusion that can potentially be used to fabricate GaN based in‐plane lasers. We demonstrate successful fusion of GaN to InP without voids or oxide at the interface and fabricate optically flat cleaved GaN facets that are parallel to the crystallographic planes of the host InP. I–V measurements have been performed across the n‐N fused interface. These results show that the fused junction exhibits a barrier of several electron volts for electrons passing from the InP to the GaN and ohmic conduction of electrons moving in the opposite direction.
Izvorni jezik
Engleski
Znanstvena područja
Elektrotehnika
Citiraj ovu publikaciju:
Časopis indeksira:
- Web of Science Core Collection (WoSCC)
- Science Citation Index Expanded (SCI-EXP)
- SCI-EXP, SSCI i/ili A&HCI
- Scopus