Naslov
Adhesion control in semiconductor processing via Fourier Transform Infrared Spectroscopy

Autori
Omazic, Marko ; Oreski, Gernot ; Pinczolits, Michael ; Erceg, Matko ; Pinter, Gerald

Vrsta, podvrsta i kategorija rada
Sažeci sa skupova, sažetak, znanstveni

Izvornik
Book of abstracts of 20th European Symposium on Polymer Spectroscopy / - Dresden : Leibniz-Institut für Polymerforschung Dresden e.V., 2016, 12-13

ISBN
978-3-9816007-4-2

Skup
20th European Symposium on Polymer Spectroscopy

Mjesto i datum
Dresden, Njemačka, 11.09.2016. - 14.09.2016

Vrsta sudjelovanja
Poster

Vrsta recenzije
Međunarodna recenzija

Ključne riječi
FTIR ; dicing tape ; semiconductor processing

Sažetak
Polymer film with an adhesive layer commonly known as a dicing tape is state of the art for semiconductor processing, providing mechanical protection and ensuring temporary bonding of semiconductors. At the first stage where the wafer is laminated and processed on the dicing tape, high adhesion is needed to enable optimum mechanical sawing results. Before pick-up, the adhesion strength is reduced by UV irradiation for an easy pick-up of separated semiconductor dies. During UV irradiation, the adhesive layer is cross-linked and the most prominent change in chemical structure can be attributed to the double bond of the acrylic adhesive. Thus, the decrease of the double bond groups after UV irradiation can be correlated with decrease in adhesion strength. Control of the adhesion strength on the interface semiconductor/dicing tape represents a crucial parameter for successful processing of semiconductor chips. Infrared Spectroscopy (FTIR) allows us to get an insight in changes of the chemical structure of the surface adhesive layer before and after the UV exposure process. Therefore, FTIR was used as a method for characterization of the chemical structure of the adhesive, while peel test was used to characterize changes in physical-mechanical properties. Different dicing tapes were investigated. According to the first results obtained from FTIR and peel test, an excellent correlation between relative concentration of acrylate double bond and peel strength was found. The results showed high potential to stabilize adhesion performance and to reduce yield loss of the chips via FTIR. More investigations in order to establish a model for understanding are planned.

Izvorni jezik
Engleski

Znanstvena područja
Kemijsko inženjerstvo

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