Pregled bibliografske jedinice broj: 819459
On the influence of thermal stresses on eigenvalues of a circular saw blade
On the influence of thermal stresses on eigenvalues of a circular saw blade // Journal of Mechanical Engineering Science, Part C : Proceedings of the Institution of Mechanical Engineers, 231 (2016), 96-108 doi:10.1177/0954406216641148 (međunarodna recenzija, članak, znanstveni)
CROSBI ID: 819459 Za ispravke kontaktirajte CROSBI podršku putem web obrasca
Naslov
On the influence of thermal stresses on eigenvalues of a circular saw blade
Autori
Anđelić, Nikola ; Žigulić, Roberto ; Čanađija, Marko
Izvornik
Journal of Mechanical Engineering Science, Part C : Proceedings of the Institution of Mechanical Engineers (0954-4062) 231
(2016);
96-108
Vrsta, podvrsta i kategorija rada
Radovi u časopisima, članak, znanstveni
Ključne riječi
Circular saw blade ; modal analysis ; thermal stresses
Sažetak
The paper presents a thermomechanical analysis of a circular saw with the emphasis on the influence of thermal stresses on eigenmodes. Significance of the slot’s length was also investigated. The transient thermal analysis was carried out, and based on the obtained temperature field, the modal analysis was performed accounting for both thermal and centrifugal stresses. It was found that thermal stresses have a profound influence on eigenvalues. The results clearly indicate a necessity of performing analyses of this kind in order to obtain an efficient design of the circular saw. At the end, main findings are emphasized once more.
Izvorni jezik
Engleski
Znanstvena područja
Strojarstvo, Temeljne tehničke znanosti
POVEZANOST RADA
Projekti:
IPA CBC/2nd/0127/AdriaHUB
HRZZ-IP-2013-11-6876 - Procjena ponašanja konstrukcija u graničnim uvjetima rada (STRUBECON) (Brnić, Josip, HRZZ - 2013-11) ( CroRIS)
Ustanove:
Tehnički fakultet, Rijeka
Poveznice na cjeloviti tekst rada:
doi
Citiraj ovu publikaciju:
Časopis indeksira:
- Current Contents Connect (CCC)
- Web of Science Core Collection (WoSCC)
- Science Citation Index Expanded (SCI-EXP)
- SCI-EXP, SSCI i/ili A&HCI
- Scopus