Pregled bibliografske jedinice broj: 76512
A Correction of Measured Power MOSFET's Normalized Temperature Response Because of Case Temperature Rise
A Correction of Measured Power MOSFET's Normalized Temperature Response Because of Case Temperature Rise // EPE - Power electronics and applications, Materials and devices
London : Delhi, 1993. str. 143-148 (predavanje, međunarodna recenzija, cjeloviti rad (in extenso), znanstveni)
CROSBI ID: 76512 Za ispravke kontaktirajte CROSBI podršku putem web obrasca
Naslov
A Correction of Measured Power MOSFET's Normalized Temperature Response Because of Case Temperature Rise
Autori
Jakopović, Željko ; Benčić, Zvonko ; Žunac, Robert
Vrsta, podvrsta i kategorija rada
Radovi u zbornicima skupova, cjeloviti rad (in extenso), znanstveni
Izvornik
EPE - Power electronics and applications, Materials and devices
/ - London : Delhi, 1993, 143-148
Skup
5th European Conference on Power Electronics and Applications
Mjesto i datum
London, Ujedinjeno Kraljevstvo, 13.09.1993. - 16.09.1993
Vrsta sudjelovanja
Predavanje
Vrsta recenzije
Međunarodna recenzija
Ključne riječi
Power MOSFET ; transient thermal impedance ; normalized temperature response ; measurement of transient thermal impedance
Sažetak
A method of power MOSFET's normalized temperature response (transient thermal impedance) measurement and correction is presented. During semiconductor device's normalized temperature response measurement it is practically impossible to maintain constant temperature required by a definition of normalized temperature response. Introduced method enables a correction ofthe measurement error caused by the semiconductor device's case temperature rise. It is based on finding semiconductor device's thermal system model parameters and identifying the point on thermal model which belongs to semiconductor device's case. Measurements of power MOSFET's normalized temperature response are made with a help of a computer controlled electrical method, with semiconductor device mounted on real heat sink. A developed software package enables: (i) graphical presentation of temperature responses, (ii) identification of semiconductor device thermal system parameters, and (iii) correction of measurement error caused by semiconductor device's case temperature rise.
Izvorni jezik
Engleski
POVEZANOST RADA
Ustanove:
Fakultet elektrotehnike i računarstva, Zagreb