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Pregled bibliografske jedinice broj: 55453

Clean galena, contaminated lead, and soft errors in memory chips


Lykken, G.I; Hustoff, J; Ziegler, B; Momčilović, Berislav
Clean galena, contaminated lead, and soft errors in memory chips // Journal of Electronic Materials, 29 (2000), 10; 1290-1293 (međunarodna recenzija, članak, znanstveni)


CROSBI ID: 55453 Za ispravke kontaktirajte CROSBI podršku putem web obrasca

Naslov
Clean galena, contaminated lead, and soft errors in memory chips

Autori
Lykken, G.I ; Hustoff, J ; Ziegler, B ; Momčilović, Berislav

Izvornik
Journal of Electronic Materials (0361-5235) 29 (2000), 10; 1290-1293

Vrsta, podvrsta i kategorija rada
Radovi u časopisima, članak, znanstveni

Ključne riječi
Computer chip memory; soft errors; tin-solder bumps; no-alpha galena; alpha lead; no-alpha lead; radon progeny

Sažetak
Lead (Pb) disks were exposed to a radon(Rn)rich atmosphere and surface alpha particle emission was detected over time. Cummulative 210Po alpha emission increased nearly linearly with time. Conversly, cummulative emission for each of218Po and 214Po was constant after one and two hours, respectively. Processing of radiation-free Pb ore (galena) in inert atmosphere was compared with processing in ambient air. Ambient air introduced Rn and its progeny (RAD) into the flux during processing so that the processed Pb contained Po isotopes. A typical coke used in lead smelting emitted numerous alpha particles. We postulated that alpha particles from tin/lead solder bumps, a cause of computer chip memory soft errors, may originate from Rn and RAD in the ambient air and/or coke used as a reducing agent in the standard galena smelting procedure.

Izvorni jezik
Engleski

Znanstvena područja
Temeljne medicinske znanosti



POVEZANOST RADA


Projekti:
00220108

Ustanove:
Institut za medicinska istraživanja i medicinu rada, Zagreb

Profili:

Avatar Url Berislav Momčilović (autor)


Citiraj ovu publikaciju:

Lykken, G.I; Hustoff, J; Ziegler, B; Momčilović, Berislav
Clean galena, contaminated lead, and soft errors in memory chips // Journal of Electronic Materials, 29 (2000), 10; 1290-1293 (međunarodna recenzija, članak, znanstveni)
Lykken, G., Hustoff, J., Ziegler, B. & Momčilović, B. (2000) Clean galena, contaminated lead, and soft errors in memory chips. Journal of Electronic Materials, 29 (10), 1290-1293.
@article{article, author = {Lykken, G.I and Hustoff, J and Ziegler, B and Mom\v{c}ilovi\'{c}, Berislav}, year = {2000}, pages = {1290-1293}, keywords = {Computer chip memory, soft errors, tin-solder bumps, no-alpha galena, alpha lead, no-alpha lead, radon progeny}, journal = {Journal of Electronic Materials}, volume = {29}, number = {10}, issn = {0361-5235}, title = {Clean galena, contaminated lead, and soft errors in memory chips}, keyword = {Computer chip memory, soft errors, tin-solder bumps, no-alpha galena, alpha lead, no-alpha lead, radon progeny} }
@article{article, author = {Lykken, G.I and Hustoff, J and Ziegler, B and Mom\v{c}ilovi\'{c}, Berislav}, year = {2000}, pages = {1290-1293}, keywords = {Computer chip memory, soft errors, tin-solder bumps, no-alpha galena, alpha lead, no-alpha lead, radon progeny}, journal = {Journal of Electronic Materials}, volume = {29}, number = {10}, issn = {0361-5235}, title = {Clean galena, contaminated lead, and soft errors in memory chips}, keyword = {Computer chip memory, soft errors, tin-solder bumps, no-alpha galena, alpha lead, no-alpha lead, radon progeny} }

Časopis indeksira:


  • Current Contents Connect (CCC)
  • Web of Science Core Collection (WoSCC)
    • SCI-EXP, SSCI i/ili A&HCI


Uključenost u ostale bibliografske baze podataka::


  • The INSPEC Science Abstracts series





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