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Pregled bibliografske jedinice broj: 503277

Integration of MOSFETs with SiGe dots as stressor material


Nanver, Lis K.; Jovanović, Vladimir; Biasotto, Cleber; Moers, Juergen; Gruetzmacher, Detlev; Zhang, Jianjun; Hrauda, Nina; Stoffel, Mathieu; Pezzoli, Fabio; Schmidt, Oliver G. et al.
Integration of MOSFETs with SiGe dots as stressor material // Solid-state electronics, 60 (2011), 1; 75-83 doi:10.1016/j.sse.2011.01.038 (međunarodna recenzija, članak, znanstveni)


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Naslov
Integration of MOSFETs with SiGe dots as stressor material

Autori
Nanver, Lis K. ; Jovanović, Vladimir ; Biasotto, Cleber ; Moers, Juergen ; Gruetzmacher, Detlev ; Zhang, Jianjun ; Hrauda, Nina ; Stoffel, Mathieu ; Pezzoli, Fabio ; Schmidt, Oliver G. ; Miglio, Leo ; Kosina, Hans ; Marzegalli, Anna ; Vastola, Guglielmo ; Mussler, Gregor ; Stangl, Julian ; Bauer, Guenther ; van der Cingel, Johan ; Bonera, Emiliano

Izvornik
Solid-state electronics (0038-1101) 60 (2011), 1; 75-83

Vrsta, podvrsta i kategorija rada
Radovi u časopisima, članak, znanstveni

Ključne riječi
silicon–germanium dots; Stranski–Krastanow mode; stressor materials; MOSFET; CMOS; excimer-laser annealing; metal gates; mobility enhancement

Sažetak
The potentials of using silicon–germanium dots as stressor material in MOSFETs are evaluated with respect to integration in today’s production processes. Work is reviewed that has lead to the fabrication of the first experimental n-channel MOSFETs on SiGe dots, referred to as DotFETs, in a low-complexity, custom-made low-temperature process where the dot is preserved during the entire device processing. The SiGe dots were grown in large regular arrays in a Stranski–Krastanow (S–K) mode and used to induce biaxial tensile strain in a silicon capping-layer. The DotFETs are processed with the main gate-segment above the strained Si layer on a single dot. To prevent intermixing of the Si/SiGe/Si structure, the processing temperature is kept below 400 C by using excimer-laser annealing to activate the source/drain implants that are self-aligned to a metal gate. The crystallinity of the structure is preserved throughout the processing and, compared to reference devices, an average increase in drain current up to 22.5% is obtained. The experimental results are substantiated by extensive simulations and modeling of the strain levels in capped dots and the corresponding mobility enhancement achievable with DotFETs. The concept of SiGe dots overgrown with a Si layer is also considered for use as a starting structure for silicon-on-nothing (SON) technology where the dot should be removed after the formation of the gate-stack and the strain for mobility enhancement should be preserved (and possibly increased) via the other device layers.

Izvorni jezik
Engleski

Znanstvena područja
Elektrotehnika

Napomena
Odabrani radova sa skupa The 5th International SiGe Technology and Devices Meeting (ISTDM 2010) ; Mikael Ostling, B. Gunnar Malm, Henry H. Radamson (ur.)



POVEZANOST RADA


Projekti:
036-0361566-1567 - Nanometarski elektronički elementi i sklopovske primjene (Suligoj, Tomislav, MZO ) ( CroRIS)
036-0982904-1642 - Sofisticirane poluvodičke strukture za komunikacijsku tehnologiju (Koričić, Marko, MZO ) ( CroRIS)

Ustanove:
Fakultet elektrotehnike i računarstva, Zagreb

Profili:

Avatar Url Vladimir Jovanović (autor)

Citiraj ovu publikaciju:

Nanver, Lis K.; Jovanović, Vladimir; Biasotto, Cleber; Moers, Juergen; Gruetzmacher, Detlev; Zhang, Jianjun; Hrauda, Nina; Stoffel, Mathieu; Pezzoli, Fabio; Schmidt, Oliver G. et al.
Integration of MOSFETs with SiGe dots as stressor material // Solid-state electronics, 60 (2011), 1; 75-83 doi:10.1016/j.sse.2011.01.038 (međunarodna recenzija, članak, znanstveni)
Nanver, L., Jovanović, V., Biasotto, C., Moers, J., Gruetzmacher, D., Zhang, J., Hrauda, N., Stoffel, M., Pezzoli, F. & Schmidt, O. (2011) Integration of MOSFETs with SiGe dots as stressor material. Solid-state electronics, 60 (1), 75-83 doi:10.1016/j.sse.2011.01.038.
@article{article, author = {Nanver, Lis K. and Jovanovi\'{c}, Vladimir and Biasotto, Cleber and Moers, Juergen and Gruetzmacher, Detlev and Zhang, Jianjun and Hrauda, Nina and Stoffel, Mathieu and Pezzoli, Fabio and Schmidt, Oliver G. and Miglio, Leo and Kosina, Hans and Marzegalli, Anna and Vastola, Guglielmo and Mussler, Gregor and Stangl, Julian and Bauer, Guenther and van der Cingel, Johan and Bonera, Emiliano}, year = {2011}, pages = {75-83}, DOI = {10.1016/j.sse.2011.01.038}, keywords = {silicon–germanium dots, Stranski–Krastanow mode, stressor materials, MOSFET, CMOS, excimer-laser annealing, metal gates, mobility enhancement}, journal = {Solid-state electronics}, doi = {10.1016/j.sse.2011.01.038}, volume = {60}, number = {1}, issn = {0038-1101}, title = {Integration of MOSFETs with SiGe dots as stressor material}, keyword = {silicon–germanium dots, Stranski–Krastanow mode, stressor materials, MOSFET, CMOS, excimer-laser annealing, metal gates, mobility enhancement} }
@article{article, author = {Nanver, Lis K. and Jovanovi\'{c}, Vladimir and Biasotto, Cleber and Moers, Juergen and Gruetzmacher, Detlev and Zhang, Jianjun and Hrauda, Nina and Stoffel, Mathieu and Pezzoli, Fabio and Schmidt, Oliver G. and Miglio, Leo and Kosina, Hans and Marzegalli, Anna and Vastola, Guglielmo and Mussler, Gregor and Stangl, Julian and Bauer, Guenther and van der Cingel, Johan and Bonera, Emiliano}, year = {2011}, pages = {75-83}, DOI = {10.1016/j.sse.2011.01.038}, keywords = {silicon–germanium dots, Stranski–Krastanow mode, stressor materials, MOSFET, CMOS, excimer-laser annealing, metal gates, mobility enhancement}, journal = {Solid-state electronics}, doi = {10.1016/j.sse.2011.01.038}, volume = {60}, number = {1}, issn = {0038-1101}, title = {Integration of MOSFETs with SiGe dots as stressor material}, keyword = {silicon–germanium dots, Stranski–Krastanow mode, stressor materials, MOSFET, CMOS, excimer-laser annealing, metal gates, mobility enhancement} }

Časopis indeksira:


  • Current Contents Connect (CCC)
  • Web of Science Core Collection (WoSCC)
    • Science Citation Index Expanded (SCI-EXP)
    • SCI-EXP, SSCI i/ili A&HCI
  • Scopus


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