Pregled bibliografske jedinice broj: 432451
Effects of thermal annealing on structural and electrical properties of sputtered W– Ti thin films
Effects of thermal annealing on structural and electrical properties of sputtered W– Ti thin films // Surface & coatings technology, 204 (2010), 12-13; 2099-2102 doi:10.1016/j.surfcoat.2009.09.048 (međunarodna recenzija, članak, znanstveni)
CROSBI ID: 432451 Za ispravke kontaktirajte CROSBI podršku putem web obrasca
Naslov
Effects of thermal annealing on structural and electrical properties of sputtered W– Ti thin films
Autori
Petrović, Suzana ; Peruško, Davor ; Gaković, B. ; Mitrić, M. ; Kovač, J. ; Zalar, A. ; Milinović, V. ; Bogdanović-Radović, Ivančica ; Milosavljević, Momir
Izvornik
Surface & coatings technology (0257-8972) 204
(2010), 12-13;
2099-2102
Vrsta, podvrsta i kategorija rada
Radovi u časopisima, članak, znanstveni
Ključne riječi
W– Ti thin films ; thermal annealing ; XPS ; RBS ; TEM
Sažetak
In this work we have studied the influence of thermal annealing on the structural and electrical properties of W– Ti thin films, deposited on n-type (100) silicon wafers. The films were deposited by d.c. sputtering from a 90:10 wt.% W– Ti target, using Ar ions, to a thickness of ~ 170 nm. After deposition the samples were annealed at 400 to 700 °C for 60 min, in a nitrogen ambient. Structural characterizations were performed by X-ray photoelectron spectroscopy (XPS), Rutherford backscattering spectrometry (RBS), X-ray diffraction (XRD) and transmission electron microscopy (TEM). A four-point probe was used for electrical characterization. It was found that the as-deposited films exhibit a polycrystalline structure in the form of columnar grains (20– 50 nm in diameter). Only b.c.c. W phase could be registered in the films, while any presence of crystalline Ti was hindered in XRD and electron diffraction patterns. Annealing at up to 600 °C resulted in an increase of the mean grain size in the films, and a decrease of their sheet resistance. For these annealing temperatures we did not register any interaction at the W– Ti/Si interface. However, upon annealing at 700 °C, a progressed interaction between the film and the substrate occurred. Structural analyses suggest the formation of both W and Ti silicides. The estimated thickness of the formed metal-silicide layer is approximately 125 nm. Sheet resistance increased rapidly after annealing at 700 °C, because a large portion of the original metallic film was consumed in the reaction with silicon.
Izvorni jezik
Engleski
Znanstvena područja
Fizika
POVEZANOST RADA
Projekti:
098-1191005-2876 - Procesi interakcije ionskih snopova i nanostrukture (Jakšić, Milko, MZOS ) ( CroRIS)
Ustanove:
Institut "Ruđer Bošković", Zagreb
Profili:
Ivančica Bogdanović Radović
(autor)
Citiraj ovu publikaciju:
Časopis indeksira:
- Current Contents Connect (CCC)
- Web of Science Core Collection (WoSCC)
- Science Citation Index Expanded (SCI-EXP)
- SCI-EXP, SSCI i/ili A&HCI
- Scopus