Pregled bibliografske jedinice broj: 400602
Integration of Laser-Annealed Junctions in a Low- Temperature High-k Metal-Gate MISFET
Integration of Laser-Annealed Junctions in a Low- Temperature High-k Metal-Gate MISFET // Proceedings of the 10th International Conference on ULtimate Integration of Silicon / Mantl, S. ; Lemme, M. ; Schubert, J. ; Albrecht, W. (ur.).
Aachen, Njemačka, 2009. str. 181-184 (poster, međunarodna recenzija, cjeloviti rad (in extenso), znanstveni)
CROSBI ID: 400602 Za ispravke kontaktirajte CROSBI podršku putem web obrasca
Naslov
Integration of Laser-Annealed Junctions in a Low- Temperature High-k Metal-Gate MISFET
Autori
Biasotto, Cleber ; Jovanović, Vladimir ; Gonda, Viktor ; van der Cingel, Johan ; Milosavljević, Silvana ; Nanver, Lis K.
Vrsta, podvrsta i kategorija rada
Radovi u zbornicima skupova, cjeloviti rad (in extenso), znanstveni
Izvornik
Proceedings of the 10th International Conference on ULtimate Integration of Silicon
/ Mantl, S. ; Lemme, M. ; Schubert, J. ; Albrecht, W. - , 2009, 181-184
ISBN
978-1-4244-3705-4
Skup
10th International Conference on ULtimate Integration of Silicon
Mjesto i datum
Aachen, Njemačka, 18.03.2009. - 20.03.2009
Vrsta sudjelovanja
Poster
Vrsta recenzije
Međunarodna recenzija
Ključne riječi
MISFET; high-k; laser annealing
Sažetak
Integration and properties of devices processed by excimer laser annealing are presented. The best results are achieved by shallow implantations into a native-oxide-free silicon surface and laser annealing with the remainder of the device protected by an Al reflective layer. Low- temperature MISFETs are fabricated with a metal- gate high-k gate stack of PECVD SiO2 and ALD Al2O3 with an EOT of 9.2 nm and an Al-gate. The source/drain regions are self-aligned to the metal gate, which also serves as a laser masking reflective layer. Ablation of the masking layer is prevented due to the low thermal resistance of the thin underlying gate dielectric. The measured devices exhibit good current drivability, which improves with higher laser energy. The maximum processing temperature of the presented MISFETs is 400 C and can potentially to be reduced down to 300 C.
Izvorni jezik
Engleski
Znanstvena područja
Elektrotehnika
POVEZANOST RADA
Projekti:
036-0361566-1567 - Nanometarski elektronički elementi i sklopovske primjene (Suligoj, Tomislav, MZO ) ( CroRIS)
036-0982904-1642 - Sofisticirane poluvodičke strukture za komunikacijsku tehnologiju (Koričić, Marko, MZO ) ( CroRIS)
Ustanove:
Fakultet elektrotehnike i računarstva, Zagreb
Profili:
Vladimir Jovanović
(autor)