Naslov
Characterization of 8-pin Shrink Small Outline Package by Using Electromagnetic Simulations

Autori
Mandić, Tvrtko ; Barić, Adrijan

Vrsta, podvrsta i kategorija rada
Radovi u zbornicima skupova, cjeloviti rad (in extenso), znanstveni

Izvornik
PROCEEDINGS Vol. I. MEET & GVS / Biljanović, Petar ; Skala, Karolj - Rijeka : Hrvatska udruga za informacijsku i komunikacijsku tehnologiju, elektroniku i mikroelektroniku - MIPRO, 2008, 197-201

ISBN
978-953-233-036-6

Skup
MIPRO

Mjesto i datum
Opatija, Hrvatska, 26.05.2008. - 30.05.2008

Vrsta sudjelovanja
Predavanje

Vrsta recenzije
Međunarodna recenzija

Ključne riječi
package simulation; circuit modelling; Shrink Small Outline Package (SSOP)

Sažetak
The performance of high frequency integrated circuits is highly dependent on package layout. The material of lead frames and bond wires as well as their layout may have substantial influence on integrated circuit performance. This paper presents the comparison of the simulation results obtained by Cadence RF IC Package Modeler and by using CST Microwave Studio 3-D electromagnetic simulator. The simulation results are also compared to the results obtained by using the package model parameters provided by Amkor Technologies. The comparison shows that the results obtained by the 3-D electromagnetic simulator CST are comparable to the results obtained by Cadence and Amkor model parameters. CST is the most reliable simulation approach, although it takes much more time to set up simulations to obtain physically consistent results.

Izvorni jezik
Engleski

Znanstvena područja
Elektrotehnika

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