Pregled bibliografske jedinice broj: 358069
Broad-Band Equivalent Circuit Modelling of Passive SMT Components Embedded in Conductor Backed Coplanar Waveguide Structures
Broad-Band Equivalent Circuit Modelling of Passive SMT Components Embedded in Conductor Backed Coplanar Waveguide Structures // Proceedings of MEET and HGS, vol. I / Biljanović, Petar ; Skala, Karolj (ur.).
Opatija: Hrvatska udruga za informacijsku i komunikacijsku tehnologiju, elektroniku i mikroelektroniku - MIPRO, 2008. str. 191-196 (predavanje, međunarodna recenzija, cjeloviti rad (in extenso), znanstveni)
CROSBI ID: 358069 Za ispravke kontaktirajte CROSBI podršku putem web obrasca
Naslov
Broad-Band Equivalent Circuit Modelling of Passive SMT Components Embedded in Conductor Backed Coplanar Waveguide Structures
Autori
Čeperić, Vladimir ; Pejčinović, Branimir ; Barić, Adrijan
Vrsta, podvrsta i kategorija rada
Radovi u zbornicima skupova, cjeloviti rad (in extenso), znanstveni
Izvornik
Proceedings of MEET and HGS, vol. I
/ Biljanović, Petar ; Skala, Karolj - Opatija : Hrvatska udruga za informacijsku i komunikacijsku tehnologiju, elektroniku i mikroelektroniku - MIPRO, 2008, 191-196
ISBN
978-953-233-036-6
Skup
MIPRO 2008
Mjesto i datum
Opatija, Hrvatska, 26.05.2008. - 30.05.2008
Vrsta sudjelovanja
Predavanje
Vrsta recenzije
Međunarodna recenzija
Ključne riječi
Modelling of Passive SMT Components
Sažetak
This paper presents methodology for broad-band equivalent circuit modelling of SMT components embedded in conductor backed coplanar waveguide structures (CB-CPW). Although high frequency/high speed design still predominantly uses microstrip lines, the use of CB-CPW lines is more suitable for the applications where EM immunity is important. Compared to CB-CPW, microstrip lines are more susceptible to interference (EMI) and generate more interference themselves. SMT components are embedded into CB-CPWs, measured and modelled on 0.6, 1 and 1.6 mm thick FR4 test PCBs. The structures are measured by G-S-G probes in order to avoid the influence of connectors. The semi-automated methodology presented in this paper significantly decreases the time needed to model SMT components, while retaining the accuracy and robustness. The resulting modelling procedure is capable of describing SMT component characteristics having different nominal values and package sizes on various thicknesses of the substrate, which proves the quality of the model.
Izvorni jezik
Engleski
Znanstvena područja
Elektrotehnika
POVEZANOST RADA
Projekti:
036-0361621-1622 - Kvaliteta signala u integriranim sklopovima s mješovitim signalom (Barić, Adrijan, MZO ) ( CroRIS)
Ustanove:
Fakultet elektrotehnike i računarstva, Zagreb