Pregled bibliografske jedinice broj: 215193
Enhanced diffusion of Cu in aluminium under low-energy ion bombardment
Enhanced diffusion of Cu in aluminium under low-energy ion bombardment // Europhysics letters, 71 (2005), 5; 757-762 doi:10.1209/epl/i2004-10548-y (međunarodna recenzija, članak, znanstveni)
CROSBI ID: 215193 Za ispravke kontaktirajte CROSBI podršku putem web obrasca
Naslov
Enhanced diffusion of Cu in aluminium under low-energy ion bombardment
Autori
Šternberger, Zdenko ; Stupnišek, Mladen
Izvornik
Europhysics letters (0295-5075) 71
(2005), 5;
757-762
Vrsta, podvrsta i kategorija rada
Radovi u časopisima, članak, znanstveni
Ključne riječi
plasma-material interactions; boundary layer effects; diffusion; interface formation
Sažetak
Sputter deposition of cupper on aluminium, under bombardment of low-energy ions resulted in the formation of two interfacial zones. The mean diffusion coefficient effective in the formation of the first zone, ≤ 3 x 10-10 cm2/s, is attributed to vacancy supersaturation. The results strongly suggest that by supplying the necessary energy for the formation of vacancies, the activation energy for diffusion can be reduced to the level of the enthalpy of migration, provided lifetimes of freely migration defects are sufficiently long.
Izvorni jezik
Engleski
Znanstvena područja
Strojarstvo
POVEZANOST RADA
Projekti:
0120039
Ustanove:
Institut "Ruđer Bošković", Zagreb,
Fakultet strojarstva i brodogradnje, Zagreb
Profili:
Mladen Stupnišek
(autor)
Citiraj ovu publikaciju:
Časopis indeksira:
- Current Contents Connect (CCC)
- Web of Science Core Collection (WoSCC)
- Science Citation Index Expanded (SCI-EXP)
- SCI-EXP, SSCI i/ili A&HCI
- Scopus
