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Pregled bibliografske jedinice broj: 1066086

European Processor Initiative (EPI)—An Approach for a Future Automotive eHPC Semiconductor Platform

Kovač, Mario; Reinhardt, Dominik; Jesorsky, Oliver; Traub, Matthias; Denis, Jean-Marc; Notton, Philippe
European Processor Initiative (EPI)—An Approach for a Future Automotive eHPC Semiconductor Platform // Electronic Components and Systems for Automotive Applications / Langheim, Jochen (ur.).
Pariz: Springer, 2019. str. 185-195 doi:10.1007/978-3-030-14156-1_15

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Naslov
European Processor Initiative (EPI)—An Approach for a Future Automotive eHPC Semiconductor Platform

Autori
Kovač, Mario ; Reinhardt, Dominik ; Jesorsky, Oliver ; Traub, Matthias ; Denis, Jean-Marc ; Notton, Philippe

Vrsta, podvrsta i kategorija rada
Poglavlja u knjigama, znanstveni

Knjiga
Electronic Components and Systems for Automotive Applications

Urednik/ci
Langheim, Jochen

Izdavač
Springer

Grad
Pariz

Godina
2019

Raspon stranica
185-195

ISBN
978-3-030-14156-1

ISSN
2196-5544

Ključne riječi
eHPC, automotive, HPC, Common Platform, EPI

Sažetak
: In this paper we present a novel approach for a future automotive embedded highperformance computing (eHPC) platform. The platform is based on an European Processor Initiative (EPI), Common Platform (CP). This paper also gives an overview of the automotive industry's challenges and the general architectural aspects of EPI CP.

Izvorni jezik
Engleski



POVEZANOST RADA

Profili:

Avatar Url Mario Kovač (autor)

Poveznice na cjeloviti tekst rada:

doi

Citiraj ovu publikaciju:

Kovač, Mario; Reinhardt, Dominik; Jesorsky, Oliver; Traub, Matthias; Denis, Jean-Marc; Notton, Philippe
European Processor Initiative (EPI)—An Approach for a Future Automotive eHPC Semiconductor Platform // Electronic Components and Systems for Automotive Applications / Langheim, Jochen (ur.).
Pariz: Springer, 2019. str. 185-195 doi:10.1007/978-3-030-14156-1_15
Kovač, M., Reinhardt, D., Jesorsky, O., Traub, M., Denis, J. & Notton, P. (2019) European Processor Initiative (EPI)—An Approach for a Future Automotive eHPC Semiconductor Platform. U: Langheim, J. (ur.) Electronic Components and Systems for Automotive Applications. Pariz, Springer, str. 185-195 doi:10.1007/978-3-030-14156-1_15.
@inbook{inbook, author = {Kova\v{c}, Mario and Reinhardt, Dominik and Jesorsky, Oliver and Traub, Matthias and Denis, Jean-Marc and Notton, Philippe}, editor = {Langheim, J.}, year = {2019}, pages = {185-195}, DOI = {10.1007/978-3-030-14156-1\_15}, keywords = {eHPC, automotive, HPC, Common Platform, EPI}, doi = {10.1007/978-3-030-14156-1\_15}, isbn = {978-3-030-14156-1}, issn = {2196-5544}, title = {European Processor Initiative (EPI)—An Approach for a Future Automotive eHPC Semiconductor Platform}, keyword = {eHPC, automotive, HPC, Common Platform, EPI}, publisher = {Springer}, publisherplace = {Pariz} }
@inbook{inbook, author = {Kova\v{c}, Mario and Reinhardt, Dominik and Jesorsky, Oliver and Traub, Matthias and Denis, Jean-Marc and Notton, Philippe}, editor = {Langheim, J.}, year = {2019}, pages = {185-195}, DOI = {10.1007/978-3-030-14156-1\_15}, keywords = {eHPC, automotive, HPC, Common Platform, EPI}, doi = {10.1007/978-3-030-14156-1\_15}, isbn = {978-3-030-14156-1}, issn = {2196-5544}, title = {European Processor Initiative (EPI)—An Approach for a Future Automotive eHPC Semiconductor Platform}, keyword = {eHPC, automotive, HPC, Common Platform, EPI}, publisher = {Springer}, publisherplace = {Pariz} }

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