Pregled bibliografske jedinice broj: 1062724
Measurement and modelling of thermal loads in industrial CT scanner
Measurement and modelling of thermal loads in industrial CT scanner // EUSPEN Special Interest Group Meeting: Thermal Issues
Aachen, Njemačka, 2020. (poster, međunarodna recenzija, pp prezentacija, znanstveni)
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Naslov
Measurement and modelling of thermal loads in
industrial CT scanner
Autori
Katić, Marko ; Ferdelji, Nenad ; Šestan, Danijel
Vrsta, podvrsta i kategorija rada
Sažeci sa skupova, pp prezentacija, znanstveni
Skup
EUSPEN Special Interest Group Meeting: Thermal Issues
Mjesto i datum
Aachen, Njemačka, 26.02.2020. - 27.02.2020
Vrsta sudjelovanja
Poster
Vrsta recenzije
Međunarodna recenzija
Ključne riječi
Accuracy, Dimensional, Measurement, X-ray computed tomography
Sažetak
X-ray computed tomography (XCT) is rapidly becoming the measurement tool of choice in a wide variety of industrial sectors where commonly used measurement techniques aren’t optimal, typically when internal features of parts / assemblies need to be inspected. There are several key limiting factors when XCT is used as a metrology tool, such as relatively long measurement time, problems related to measurement of multi-material components, or insufficient energy to penetrate high-density materials while maintaining high resolution. One of the largest issues is the question of traceability of measurement results ; due to very large number of influences on measurement uncertainty, it is currently not possible to establish a classical uncertainty budget and declare a priori measurement uncertainty of XCT results. Influence of temperature on dimensional measurements is well known, and is usually relatively easy either to correct it, or to calculate its influence on the uncertainty of measurement. However, a typical industrial XCT scanner poses additional challenges: having several heat sources in a thermally well- insulated chamber and having a metrology loop in which thermal displacements cause several different errors. In this paper, we discuss one possible approach to this problem which is based, first and foremost, on extensive temperature measurement of the entire XCT metrology loop. These results are then used as ground truth for verification of simulation models, based on Finite Element Analysis (FEA), needed to establish temperature and displacement fields of XCT scanner geometry for the entire range of usable X-ray power levels. Finally, temperature measurements and FEA results are also used for verification of a simplified analytical model which could be useful in robust expression of measurement uncertainty.
Izvorni jezik
Engleski
Znanstvena područja
Strojarstvo
POVEZANOST RADA
Ustanove:
Fakultet strojarstva i brodogradnje, Zagreb