Pregled bibliografske jedinice broj: 68377
Some Properties of SiC Wide Bandgap Semiconductors
Some Properties of SiC Wide Bandgap Semiconductors // The 15th Dubrovnik International Course&Conference on the Interface among Mathematics, Chemistry and Computer Science, Book of Abstracts / ? (ur.).
Zagreb, 2000. (predavanje, međunarodna recenzija, sažetak, znanstveni)
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Naslov
Some Properties of SiC Wide Bandgap Semiconductors
Autori
B.Etlinger, D.Gracin
Vrsta, podvrsta i kategorija rada
Sažeci sa skupova, sažetak, znanstveni
Izvornik
The 15th Dubrovnik International Course&Conference on the Interface among Mathematics, Chemistry and Computer Science, Book of Abstracts
/ ? - Zagreb, 2000
Skup
The 15th Dubrovnik International Course&Conference on the Interface among Mathematics, Chemistry and Computer Science
Mjesto i datum
Dubrovnik, Hrvatska, 19.06.2000. - 24.06.2000
Vrsta sudjelovanja
Predavanje
Vrsta recenzije
Međunarodna recenzija
Ključne riječi
...
Sažetak
Silicon carbide (SiC) is a semiconductor
material, which may supplant silicon (Si), and
gallium arsenide (GaAs) in demanding electronic
applications. The outstanding material properties
of SiC allow the realization of devices, which
offer tremendous benefits over other
semiconductor devices in several specialized
areas: high power, high frequency and high
temperature electronics. The superiority of SiC
is founded in the large band-gap, high breakdown
electrical field, high saturation drift velocity
and high thermal conductivity. Also the small
lattice mismatch for III-nitride (especially GaN)
epitaxial layers make SiC as substrate material
for blue/UV optoelectronics devices.
In the late 80s and early 90 research
institutions started with the commercial offering
of high quality SiC wafers. The monocrysalline
SiC are usually prepared by (Lely method modified
by Tairov and Tsvetkov 1978.) physical vapor
transports (PVT), while the epitaxial layer is
prepared by chemical vapor deposition (CVD). SiC
crystallized in many different polytypes (3C-, 2H-
, 4H-, 6H-, 15 R-...) and their basic physical
properties, such as a variety of band-gaps
(between 2.4 and 3.3 eV), depend on type of
polytypes. Two of them, 4H- (Eg = 3.27 eV) and 6H-
SiC (Eg = 3.02 eV) are more suitable for
electronic devices.
Polycrystalline and amorphous SiC films are
also interested for investigation. We prepare the
amorphous hydrogenated silicon carbide thin
films, a-Si1-xCx:H, produced by magnetron
sputtering, with carbon concentration in range
from 100% silicon to 100% carbon. In all of
depositions, the source of silicon atoms is
magnetron cathode, while carbon is introduced
into the films during the growth, in two ways.
One is co-sputtering and other is by addition of
benzene into working gas. In first mentioned,
magnetron cathode consists of silicon and carbon
and cathode acts as a source of both types of
particles. In second one, benzene vapor is
introduced near the surface of growing films and
carbon is build into the film trough chemical
reactions at the surface, enhanced by plasma-
surface interactions.
Among the several SiC polytypes of
practical importance 6H-SiC and 4H-SiC have the
biggest impact on power devices. As the electron
mobility in 4H-SiC is twice that of 6H-SiC
perpendicular to the c-axis and about 10 times
that of 6H-SiC parallel to the c-axis, all
physically based numerical device simulators are
investigated on 4H-SiC based devices. Several
methods of numerical semiconductor simulations
are used to order the performance of device
characteristics (open-base voltage blocking
capability, current handling ability, switching
speed) of some 4H- and 6H-SiC devices (as npn
power bipolar junction transistor (BJT) or static
induction transistor (SIT)) and that results are
compared with the last fabrication of SiC
components (MESFET, BJT, JFET, SIT, tyristor, pn
junction diodes). All results show that the
device made with SiC has great performance
advantages over those made with Si or GaAs.
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Engleski
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