Naslov
Electro-thermal and mechanical stress characterization of power electronic packages

Autori
Šodan, Vice

Vrsta, podvrsta i kategorija rada
Ocjenski radovi, diplomski rad, diplomski

Fakultet
Fakultet elektrotehnike i računarstva

Mjesto
Zagreb

Datum
27.09

Godina
2012

Stranica
78

Mentor
Barić, Adrijan

Neposredni voditelj
Rhayem, Joseph

Ključne riječi
electro-thermal characterization; mechanical stress characterization; electronic packages

Sažetak
This work presents a characterization of a thermally induced stress in power devices and examines the influence of the thermally induced stress on interconnection layers of semiconductor power devices. The first chapter of the thesis contains a definition of a mechanical stress, theoretical explanations of different stress equations and mathematical descriptions of a thermal induced stress, needed for a better understanding thematic of problems examined in the thesis. The following sections, till the end of the thesis, are related to the Finite Element Analysis (FEA). Thermo-mechanical and power- mechanical FEM simulations were performed for variety kind of the structures in order to find causes and consequences related to a thermal induced stress. The first simulation is related to package size dimensions with several different dimensions of an interconnection and passivation layer. The next simulation is a power-mechanical simulation ; instead of a thermal cycling a power cycling is performed. A heat in a device is generated by means of voltage and current sources in order to simulate more realistic structures. The last chapter shows a real damaged driver used in an automotive industry. The two different simulations were performed in this section ; a macroscopic simulation for a global view and a microscopic simulation in order to get results more precisely.

Izvorni jezik
Engleski

Znanstvena područja
Elektrotehnika

POVEZANOST RADA