Pregled bibliografske jedinice broj: 426564
FinFET Considerations for 0.18 um Technology
FinFET Considerations for 0.18 um Technology // Proceedings of 45th International Conference on Microelectronics, Devices and Materials MIDEM 2009 / Topič M. ; Krč, J. ; Šorli, I. (ur.).
Ljubljana: Society for Microelectronics, Electronic Components and Materials (MIDEM), 2009. str. 91-96 (predavanje, međunarodna recenzija, cjeloviti rad (in extenso), znanstveni)
CROSBI ID: 426564 Za ispravke kontaktirajte CROSBI podršku putem web obrasca
Naslov
FinFET Considerations for 0.18 um Technology
Autori
Jovanović, Vladimir ; Poljak, Mirko ; Suligoj, Tomislav
Vrsta, podvrsta i kategorija rada
Radovi u zbornicima skupova, cjeloviti rad (in extenso), znanstveni
Izvornik
Proceedings of 45th International Conference on Microelectronics, Devices and Materials MIDEM 2009
/ Topič M. ; Krč, J. ; Šorli, I. - Ljubljana : Society for Microelectronics, Electronic Components and Materials (MIDEM), 2009, 91-96
ISBN
978-961-91023-9-8
Skup
45th International Conference on Microelectronics, Devices and Materials MIDEM 2009
Mjesto i datum
Postojna, Slovenija, 09.09.2009. - 11.09.2009
Vrsta sudjelovanja
Predavanje
Vrsta recenzije
Međunarodna recenzija
Ključne riječi
FinFET; bulk CMOS; 0.18 um technology; nitride spacer
Sažetak
Introduction of FinFETs into future CMOS technology nodes is driven by the need to suppress the short-channel effects (SCEs). More efficient use of the silicon die area is the reason for the investigation of the FinFET integration into older CMOS technologies as a supplement or even replacement of bulk devices. The integration scheme into the standard 0.18  m process is proposed and requires only two additional dedicated masks. Evaluation of the 0.18  m FinFETs is done by comparing the 100-nm and 50-nm-wide double-gate structures with the bulk devices fabricated in the same process, using the process and device simulations. The fin devices require higher body doping concentration for the targeted threshold voltage, but pocket implants are omitted since they have better electrostatic integrity. The double-gate structures with body doping in the 1-2 1018 cm-3 range, show significantly higher ION/IOFF ratio compared to the bulk devices. The 50-nm-wide structures have the best overall performance for both digital and mixed-signal applications and validate the research into FinFET integration into older CMOS technologies.
Izvorni jezik
Engleski
Znanstvena područja
Elektrotehnika
POVEZANOST RADA
Projekti:
036-0361566-1567 - Nanometarski elektronički elementi i sklopovske primjene (Suligoj, Tomislav, MZO ) ( CroRIS)
036-0982904-1642 - Sofisticirane poluvodičke strukture za komunikacijsku tehnologiju (Koričić, Marko, MZO ) ( CroRIS)
Ustanove:
Fakultet elektrotehnike i računarstva, Zagreb