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Pregled bibliografske jedinice broj: 210375

Effect of Temperature and Composition on ThermalConductivity of “ Mlinci” Dough


Šeruga, Bernarda; Budžaki, Sandra; Ugarčić-Hardi, Žaneta; Šeruga, Marijan
Effect of Temperature and Composition on ThermalConductivity of “ Mlinci” Dough // Czech journal of food sciences, 23 (2005), 4; 152-158 (međunarodna recenzija, članak, znanstveni)


CROSBI ID: 210375 Za ispravke kontaktirajte CROSBI podršku putem web obrasca

Naslov
Effect of Temperature and Composition on ThermalConductivity of “ Mlinci” Dough

Autori
Šeruga, Bernarda ; Budžaki, Sandra ; Ugarčić-Hardi, Žaneta ; Šeruga, Marijan

Izvornik
Czech journal of food sciences (1212-1800) 23 (2005), 4; 152-158

Vrsta, podvrsta i kategorija rada
Radovi u časopisima, članak, znanstveni

Ključne riječi
steady state method; thermal properties of dough

Sažetak
Effect of temperature and compositionon thermal conductivity of “ Mlinci” dough. Czech J. Food Sci., 23: 152– 158.The objective of this study was to determine the thermal conductivity of “ Mlinci” dough T-500 and “ Mlinci” doughT-500 with the addition of eggs, wheat germs and wheat bran in the temperature range of 40°C to 70°C. Thermalconductivity was determined using modifications of guarded hot plate steady state method. For all types of dough, thermal conductivity first increased with temperature and then, after reaching maximum values, it decreased. Themaximum values for “ Mlinci” dough T-500 containing wheat germs and bran were 54°C, and for “ Mlinci” dough T-500with eggs were 58°C. The minimal value of 0.347 &plusmn ; ; 0.020 W/mK was determined for “ Mlinci” dough T-500 at 39.38°C.The maximum value 0.585 &plusmn ; ; 0.023 W/mK was determined for “ Mlinci” dough T-500 with wheat bran at 54.39°C.The thermal conductivity of “ Mlinci” dough T-500 with the addition of wheat germs and wheat bran was higher incomparison with the basic composition due to the elevated amounts of ash, water, proteins, and porosity, as well asnon-homogeneity. Based on the experimental thermal conductivity values of “ Mlinci” dough T-500 samples at varioustemperatures, quadratic polynomial equations were developed. The research results could be used for the modellingof the heat transfer of “ Mlinci” dough T-500 during processing.

Izvorni jezik
Engleski

Znanstvena područja
Prehrambena tehnologija



POVEZANOST RADA


Projekti:
0113006
0113002

Ustanove:
Prehrambeno-tehnološki fakultet, Osijek


Citiraj ovu publikaciju:

Šeruga, Bernarda; Budžaki, Sandra; Ugarčić-Hardi, Žaneta; Šeruga, Marijan
Effect of Temperature and Composition on ThermalConductivity of “ Mlinci” Dough // Czech journal of food sciences, 23 (2005), 4; 152-158 (međunarodna recenzija, članak, znanstveni)
Šeruga, B., Budžaki, S., Ugarčić-Hardi, Ž. & Šeruga, M. (2005) Effect of Temperature and Composition on ThermalConductivity of “ Mlinci” Dough. Czech journal of food sciences, 23 (4), 152-158.
@article{article, author = {\v{S}eruga, Bernarda and Bud\v{z}aki, Sandra and Ugar\v{c}i\'{c}-Hardi, \v{Z}aneta and \v{S}eruga, Marijan}, year = {2005}, pages = {152-158}, keywords = {steady state method, thermal properties of dough}, journal = {Czech journal of food sciences}, volume = {23}, number = {4}, issn = {1212-1800}, title = {Effect of Temperature and Composition on ThermalConductivity of and \#8220; Mlinci and \#8221; Dough}, keyword = {steady state method, thermal properties of dough} }
@article{article, author = {\v{S}eruga, Bernarda and Bud\v{z}aki, Sandra and Ugar\v{c}i\'{c}-Hardi, \v{Z}aneta and \v{S}eruga, Marijan}, year = {2005}, pages = {152-158}, keywords = {steady state method, thermal properties of dough}, journal = {Czech journal of food sciences}, volume = {23}, number = {4}, issn = {1212-1800}, title = {Effect of Temperature and Composition on ThermalConductivity of and \#8220; Mlinci and \#8221; Dough}, keyword = {steady state method, thermal properties of dough} }

Časopis indeksira:


  • Current Contents Connect (CCC)
  • Web of Science Core Collection (WoSCC)
    • Science Citation Index Expanded (SCI-EXP)
    • SCI-EXP, SSCI i/ili A&HCI
  • Scopus





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