Pregled bibliografske jedinice broj: 1143153
Ultrathin Hybrid SiAlCOH Dielectric Films through Ring-Opening Molecular Layer Deposition of Cyclic Tetrasiloxane
Ultrathin Hybrid SiAlCOH Dielectric Films through Ring-Opening Molecular Layer Deposition of Cyclic Tetrasiloxane // Chemistry of Materials, 33 (2021), 3; 1022-1030 doi:10.1021/acs.chemmater.0c04408 (međunarodna recenzija, članak, znanstveni)
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Naslov
Ultrathin Hybrid SiAlCOH Dielectric Films
through Ring-Opening Molecular Layer Deposition
of Cyclic Tetrasiloxane
Autori
Ashurbekova, Kristina ; Ashurbekova, Karina ; Saric, Iva ; Gobbi, Marco ; Modin, Evgeny ; Chuvilin, Andrey ; Petravic, Mladen ; Abdulagatov, Ilmutdin ; Knez, Mato
Izvornik
Chemistry of Materials (0897-4756) 33
(2021), 3;
1022-1030
Vrsta, podvrsta i kategorija rada
Radovi u časopisima, članak, znanstveni
Ključne riječi
Molecular Layer Deposition, siloxane-alumina hybrid
Sažetak
Molecular layer deposition (MLD) is a powerful vapor phase approach for growing thin polymer films with molecular-level thickness control. We applied the ring-opening MLD process to deposit a siloxane-alumina hybrid organic− inorganic thin film using tetramethyl- tetravinylcyclotetrasiloxane (V4D4) and trimethylaluminum (TMA) as precursors. In situ studies of this process with a quartz crystal microbalance (QCM) showed a linear mass increase with the number of MLD cycles within a processing temperature window between 120 and 200 °C. The QCM study also revealed self-limiting surface chemistry. A growth per cycle of 1.4 and 1.6 Å and a density of 1.9 and 2.2 g cm−3 were determined by X-ray reflectivity (XRR) for the V4D4/ TMA film deposited at 150 and 200 °C, respectively. X-ray photoelectron spectroscopy (XPS), attenuated total reflectance Fourier transform infrared spectroscopy (ATR-FTIR), and in situ QCM were employed to analyze the structural changes and composition of the film. High- resolution transmission electron microscopy (HRTEM) was used to confirm the conformality of the obtained coatings. The grown siloxane-alumina film, even as thin as 12 nm, showed an extremely low leakage current density (lower than 5.1 × 10−8 A cm− 2 at ± 2.5 MV cm−1), a dielectric constant (k) of 4.7, and a good thermal stability after one-hour annealing in air at 1100 °C. The obtained highly conformal and thermally stable siloxane-alumina insulating film can be used as a component of field-effect transistors, flash memories, and capacitors in modern electronic systems.
Izvorni jezik
Engleski
Znanstvena područja
Fizika, Kemija, Interdisciplinarne prirodne znanosti
POVEZANOST RADA
Ustanove:
Sveučilište u Rijeci - Odjel za fiziku
Citiraj ovu publikaciju:
Časopis indeksira:
- Current Contents Connect (CCC)
- Web of Science Core Collection (WoSCC)
- Science Citation Index Expanded (SCI-EXP)
- SCI-EXP, SSCI i/ili A&HCI
- Scopus