engleski

Effects of substrate temperature on change in percolation properties of ultra thin dielectric films

n this paper, we explored the impact of surface rough- ness on ultra-thin dielectrics characteristics. Simple cubic lattice is used as a base for de positing spheres of radius R, designed as a thin film, as the base for simulation of de- fects generation and depositi on. Continuum percolation model, used to generate a ro ugh surface in order to ana- lyse how roughness and temperature influence the con- ductivity, consists of randomly placed spheres of either one or some distribution of ra dii, which then form a thin, rough layer in question. It is shown that when the tem- perature of the substrate is increased material defects tend to form within the film contributing to a faster clus- ter growth and greater film conductivity. The influence of temperature on average cluster size for homogeneous dis- tribution of defects is assumed according to the applied temperature (depending on the free carrier’s diffusion length) is researched. It is evident from the performed simulations that temperature has an important influence on thin film conductivity in several different ways ; it can contribute to the increase of the number of spanning clus- ters or the average size of cl usters. This way, defects can either provide starting points for new spanning clusters or can encourage clusters merging.

percolation ; cubic lattice ; temperature ; thin films ; roughness

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