3D EM Simulations and Analysis of In-package Metal Plate Interconnecting High-side and Low- side FETs of DC-DC Converter (CROSBI ID 633997)
Prilog sa skupa u zborniku | izvorni znanstveni rad | međunarodna recenzija
Podaci o odgovornosti
Bačmaga, Josip ; Blečić, Raul ; Gillon, Renaud ; Barić, Adrijan
engleski
3D EM Simulations and Analysis of In-package Metal Plate Interconnecting High-side and Low- side FETs of DC-DC Converter
The impact of the metal plate that interconnects the high-side and low-side FETs on the behavior of a synchronous buck converter is analyzed. A 3D model of the integrated voltage regulator and PCB power planes is analyzed in electromagnetic (EM) simulator. The lumped-element model of the plate is extracted. Parametrization of the package and PCB geometry is performed to describe their influence on the plate parasitics. The operation of the converter using the integrated voltage regulator is evaluated by SPICE simulations for several sets of plate parameters to correctly estimate their influence on the resonant frequency and efficiency of the converter.
chip package ; lumped-element model ; parasitic impedance ; resonance ; synchronous buck converter
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Podaci o prilogu
364-367.
2015.
objavljeno
10.1109/ICECS.2015.7440324
Podaci o matičnoj publikaciji
Proceedings of the International Conference on Electronics, Circuits, and Systems (ICECS 2015)
Kairo: Institute of Electrical and Electronics Engineers (IEEE)
978-1-5090-0246-7
Podaci o skupu
IEEE International Conference on Electronics, Circuits, and Systems (ICECS 2015)
predavanje
06.12.2015-09.12.2015
Kairo, Egipat
