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The Use of Chemical-Mechanical Polishing and Etch-Back Techniques for Bottom Isolation of Pillar-like Devices (CROSBI ID 481519)

Prilog sa skupa u zborniku | izvorni znanstveni rad | međunarodna recenzija

Suligoj, Tomislav ; Biljanović, Petar ; Wang, K. L. The Use of Chemical-Mechanical Polishing and Etch-Back Techniques for Bottom Isolation of Pillar-like Devices // Proceedings of MIPRO 2001 / Biljanović, Petar; Skala, Karolj (ur.). Rijeka: Hrvatska udruga za informacijsku i komunikacijsku tehnologiju, elektroniku i mikroelektroniku - MIPRO, 2001. str. 3-6-x

Podaci o odgovornosti

Suligoj, Tomislav ; Biljanović, Petar ; Wang, K. L.

engleski

The Use of Chemical-Mechanical Polishing and Etch-Back Techniques for Bottom Isolation of Pillar-like Devices

The application of CMP process for the bottom isolation of pillar like devices is investigated. The use of conventional semi-rigid pad with colloidal silica slurry results in low planarization ratio (2.54), while glass pad results in a lot of defects and scratches after the wet etch-back process. The new CMP set up is proposed employing a teflon pad and slurry composed of gamma alumina powder with particles size of 50 nm diluted in DI H_2O with2.5 wt. % of KOH. The planarization ratio of 69 at the beginning of process is achieved with the final SiO_2 surface free of defects and scratches. The process has self-stopping mechanism. The effects of a decreasing removal rate for the SiO_2above pillars, and of an increasing removal rate for the field SiO_2 during the process are explained by the increase of effective contact area and the increase of pressing force on the field SiO_2.

chemical-mechanical polishing;planarization ratio; semi-rigid pad; teflon pad; self-stopping process; removal rate; pillar-like structures

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Podaci o prilogu

3-6-x.

2001.

objavljeno

Podaci o matičnoj publikaciji

Proceedings of MIPRO 2001

Biljanović, Petar; Skala, Karolj

Rijeka: Hrvatska udruga za informacijsku i komunikacijsku tehnologiju, elektroniku i mikroelektroniku - MIPRO

Podaci o skupu

MIPRO 2001 24th International Convention

predavanje

21.05.2001-25.05.2001

Opatija, Hrvatska

Povezanost rada

Elektrotehnika