engleski

Analysis of Factors that Influence Micro-Resistance Measuring

The micro-resistance measuring principle with specific forms of current distribution in the plated through-hole of printed circuit board (PCB) is analyzed in this paper. Special attention is paid to the following factors that influence the micro-resistance measuring: the hole diameter, the type of the measuring probe and the PCB thickness, and their two and three-factor interactions. The experiment with three repetition of measurement is carried out for which the dispersion analysis includes: the calculated values of the sum of the square of deviation, the mean of the square of deviation and a comparison between the calculated factors and the relevant factor given for five percent α-risk. The results of the dispersion analysis clearly indicate that the strongest factor that influences the micro-resistance measures is the PCB thickness. The overall conclusion is that the effect of each considered factor to the micro-resistance measures is expressive, but the effect of their mutual interactions is not significant in the measuring practice.

dispersion analysis; micro-resistance measuring method; plated-through hole; thickness measuring

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