engleski

Copper-nickel alloys modified with thin surface films: corrosion behavior in the presence of chloride ions

A strong influence of the Ni content in on the barrier properties of the surface films, spontaneously formed on Cu-Ni alloys (containing 10 – 40 at.% of Ni) in a slightly alkaline NaCl solution or previously produced by forming bis(diethyl|ditiocarbamate)Cu(II)|Ni(II) surface complexes, were studied under stagnant and solution impinging conditions using polarization and EIS methods. An unexpected behavior that the corrosion resistivity of alloys with x(Ni)≥20 at.% is lower than that of the Cu-10Ni alloy was explained using solid-state processes within the surface films and enhanced electronic conductivity of surface film formed on the Cu-10Ni alloy.

copper; nickel; EIS; anodic and inhibitor films; interfaces; segregation

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