engleski

Broad-Band Equivalent Circuit Modelling of Passive SMT Components Embedded in Conductor Backed Coplanar Waveguide Structures

This paper presents methodology for broad-band equivalent circuit modelling of SMT components embedded in conductor backed coplanar waveguide structures (CB-CPW). Although high frequency/high speed design still predominantly uses microstrip lines, the use of CB-CPW lines is more suitable for the applications where EM immunity is important. Compared to CB-CPW, microstrip lines are more susceptible to interference (EMI) and generate more interference themselves. SMT components are embedded into CB-CPWs, measured and modelled on 0.6, 1 and 1.6 mm thick FR4 test PCBs. The structures are measured by G-S-G probes in order to avoid the influence of connectors. The semi-automated methodology presented in this paper significantly decreases the time needed to model SMT components, while retaining the accuracy and robustness. The resulting modelling procedure is capable of describing SMT component characteristics having different nominal values and package sizes on various thicknesses of the substrate, which proves the quality of the model.

Modelling of Passive SMT Components

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