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Modular Data Center Direct Expansion HPAC Solutions – Application of R466A as Replacement for R410A (CROSBI ID 722680)

Prilog sa skupa u zborniku | izvorni znanstveni rad | međunarodna recenzija

Janković, Zvonimir ; Sieres, Jaime ; Pavković, Branimir ; Barac, Antun Modular Data Center Direct Expansion HPAC Solutions – Application of R466A as Replacement for R410A // International Refrigeration and Air Conditioning Conference: proceedings from 2022. West Lafayette (IN): Purdue University Libraries, 2022

Podaci o odgovornosti

Janković, Zvonimir ; Sieres, Jaime ; Pavković, Branimir ; Barac, Antun

engleski

Modular Data Center Direct Expansion HPAC Solutions – Application of R466A as Replacement for R410A

Direct expansion (DX) High Precision Air Conditioning (HPAC) cooling units for modular data centers operating with R410A are the focus of this article. The new potential long-term refrigerant R466A, as a replacement for R410A, for high density DX cooling units is analyzed. The steady state numerical model based on the test results of the R410A DX HPAC cooling unit is developed and validated for 5 steady state conditions. The model is used to simulate the unit HPAC DX to predict the thermodynamic conditions when the unit operates with R466A refrigerant, and the results were compared with R410A. The simulations were performed using the real boundary conditions to obtain results for the performance of the unit. The results show that the compressor produces between 11% and 14% higher refrigerant mass flow rates with R466A than with R410A. The EEV opening is between 2% and 5% higher with R466A than with R410A for the required superheat. Evaporating pressures are between 4.2% and 5.4% higher with R466A and condensing pressures are between 3.9% and 6.4% higher than with R410A. Cooling capacity and electrical power required for compressor work are higher for R410A than for R466A, a maximum of 4.5% and 8.1%, respectively. From a thermodynamic point of view, R466A is a very good substitute for R410A in data center cooling application.

HPAC ; R410A, R466A ; Modular Data Center ; High Density cooling ; HAPC DX unit design

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Podaci o prilogu

2342

2022.

objavljeno

Podaci o matičnoj publikaciji

International Refrigeration and Air Conditioning Conference: proceedings from 2022

West Lafayette (IN): Purdue University Libraries

Podaci o skupu

Purdue e-Pubs

predavanje

10.07.2022-14.07.2022

West Lafayette (IN), Sjedinjene Američke Države

Povezanost rada

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