engleski

Impact of DFM Layout Optimisation on Crosstalk Sensitivity in Deep Submicron IC Design

Wire spreading, as a post-layout optimisation technique, was developed for the purpose of improving the manufacturing yield reducing occurrences of spot defects. It affects, however, other aspects of device functionality. Increasing the space between wires decreases the coupling capacitance thus reducing crosstalk, which is of a great importance in the submicron IC design.

layout optimisation; wire spreading; crosstalk; noise sensitivity; time delay; yield

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