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Versatile BiCMOS Technology Platform for the Low-cost Integration of Multi-purpose Applications (CROSBI ID 710275)

Prilog sa skupa u zborniku | izvorni znanstveni rad | međunarodna recenzija

Suligoj, Tomislav ; Žilak, Josip ; Osrečki, Željko ; Koričić, Marko Versatile BiCMOS Technology Platform for the Low-cost Integration of Multi-purpose Applications // 2021 IEEE Latin America Electron Devices Conference (LAEDC). Institute of Electrical and Electronics Engineers (IEEE), 2021. str. 1-4 doi: 10.1109/LAEDC51812.2021.9437969

Podaci o odgovornosti

Suligoj, Tomislav ; Žilak, Josip ; Osrečki, Željko ; Koričić, Marko

engleski

Versatile BiCMOS Technology Platform for the Low-cost Integration of Multi-purpose Applications

Integration of Horizontal Current Bipolar Transistor (HCBT) with CMOS requires fewer additional fabrication steps as compared to vertical-current bipolar devices having state-of-the-art electrical characteristics both in demonstrated implanted-base technology and in simulated SiGe-base technology. HCBT’s noise characteristics and large-signal performance for RF applications is tuned by the collector region design and the optimum device for each application is identified and characterized. High-voltage transistors are demonstrated in HCBT technology with BVCEO from 2.8 V to above 70 V enabling the integration RF and power management and other high-voltage circuits. The HCBT with SiGe base exhibits a potential of further improving the highest-performance vertical-current SiGe HBTs and overcoming their integration limitations with CMOS due to geometrical and material incompatibility.

Horizontal Current Bipolar Transistor, Lateral bipolar transistors, low noise amplifier, radio-frequency power amplifier, silicon-germanium heterojunction bipolar transistor

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Podaci o prilogu

1-4.

2021.

objavljeno

10.1109/LAEDC51812.2021.9437969

Podaci o matičnoj publikaciji

2021 IEEE Latin America Electron Devices Conference (LAEDC)

Institute of Electrical and Electronics Engineers (IEEE)

978-1-6654-1510-1

Podaci o skupu

2021 IEEE Latin America Electron Devices Conference (LAEDC 2021)

pozvano predavanje

19.04.2021-21.04.2021

Meksiko

Povezanost rada

Elektrotehnika

Poveznice