engleski

Thermal properties of copper base shape memory alloy

The mechanical properties and microstructure of copper base shape memory alloys are relatively well known, while data on thermal properties (thermal conductivity, specific heat and temperature conductivity) are not available. In the frame of our investigation work thermal properties of rapidly solidified Cu-Al-Ni-Mn alloy were determined. As the first part of the work, a study and evaluation of the operation of the device for determining the thermal properties of Hot Disk TPS 2200, today one of the more modern and high- quality instruments for determining thermal properties has been carried out. In the second part of the work, the measurements and analysis of thermal properties of rapidly solidified Cu-Al-Ni-Mn shape memory alloy in accordance with the standard ISO 22007-2 at ambient and elevated temperatures has been done.

Thermal properties, thermal conductivity, measurement, copper base shape memory alloy, rapid solidification

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